Nothing Launcher v3.3.4 update out now!
- Redesigned App Drawer (Phone (3) style!)
- Essential Search
- Smoother Animations
Direct APK download available!
#NothingLauncher #Update #Android
- Redesigned App Drawer (Phone (3) style!)
- Essential Search
- Smoother Animations
Direct APK download available!
#NothingLauncher #Update #Android
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New Essential Search Bar now available on Nothing Phones! 🔍
Just update your Nothing Launcher to v3.3.4 to get universal search with quick app actions & widgets.
Just update your Nothing Launcher to v3.3.4 to get universal search with quick app actions & widgets.
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IISc Bengaluru-led ₹500 crore proposal to develop angstrom-scale chips—a bold step into the post-silicon future of semiconductors.
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🧬 What Are Angstrom-Scale Chips?
Angstrom-scale chips refer to semiconductors built at the scale of angstroms, where
1 angstrom = 0.1 nanometers. For context, today’s most advanced chips operate at the 3nm level. Angstrom-scale devices push us into the sub-nanometer realm, where traditional silicon-based transistors begin to fail due to quantum tunneling and heat dissipation issues.
To overcome these limitations, researchers are exploring 2D materials such as:
- Graphene – a single layer of carbon atoms with exceptional electrical conductivity.
- Transition Metal Dichalcogenides (TMDs) – materials like MoS₂ and WS₂ that offer tunable bandgaps, essential for transistor behavior.
- Hexagonal Boron Nitride (h-BN) – often used as an insulating layer in 2D heterostructures.
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🧪 The ₹500 Crore IISc Proposal: Core Details
The Indian Institute of Science (IISc), Bengaluru, is spearheading a ₹500 crore, 5-year research initiative to develop angstrom-scale semiconductor technology. The proposal is currently under review by the Principal Scientific Adviser (PSA) and the Ministry of Electronics and IT (MeitY).
Key elements of the proposal include:
- A 30-member interdisciplinary team of physicists, materials scientists, and electrical engineers.
- Backing from strategic institutions like NITI Aayog, DRDO, Department of Space, and the Anusandhan National Research Foundation (ANRF).
- A focus on developing indigenous capabilities in 2D material synthesis, device fabrication, and system-level integration.
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🔧 The Science Behind It
2D materials offer several advantages over silicon:
- High electron mobility (especially in graphene) for faster switching.
- Superior thermal conductivity, reducing overheating.
- Mechanical flexibility, enabling foldable and wearable electronics.
- Tunable bandgaps, essential for designing transistors at atomic scales.
These properties make them ideal candidates for angstrom-scale transistors, where silicon simply cannot function reliably.
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🧭 What Lies Ahead?
If the proposal is approved:
- IISc will establish a national research hub for angstrom-scale electronics.
- The project will create a pipeline of skilled researchers and technologists.
- India could emerge as a design and IP powerhouse in the post-silicon era.
The team has also proposed a self-sustaining roadmap beyond the initial funding phase, aiming to attract private and international collaboration.
---
🧬 What Are Angstrom-Scale Chips?
Angstrom-scale chips refer to semiconductors built at the scale of angstroms, where
1 angstrom = 0.1 nanometers. For context, today’s most advanced chips operate at the 3nm level. Angstrom-scale devices push us into the sub-nanometer realm, where traditional silicon-based transistors begin to fail due to quantum tunneling and heat dissipation issues.
To overcome these limitations, researchers are exploring 2D materials such as:
- Graphene – a single layer of carbon atoms with exceptional electrical conductivity.
- Transition Metal Dichalcogenides (TMDs) – materials like MoS₂ and WS₂ that offer tunable bandgaps, essential for transistor behavior.
- Hexagonal Boron Nitride (h-BN) – often used as an insulating layer in 2D heterostructures.
---
🧪 The ₹500 Crore IISc Proposal: Core Details
The Indian Institute of Science (IISc), Bengaluru, is spearheading a ₹500 crore, 5-year research initiative to develop angstrom-scale semiconductor technology. The proposal is currently under review by the Principal Scientific Adviser (PSA) and the Ministry of Electronics and IT (MeitY).
Key elements of the proposal include:
- A 30-member interdisciplinary team of physicists, materials scientists, and electrical engineers.
- Backing from strategic institutions like NITI Aayog, DRDO, Department of Space, and the Anusandhan National Research Foundation (ANRF).
- A focus on developing indigenous capabilities in 2D material synthesis, device fabrication, and system-level integration.
---
🔧 The Science Behind It
2D materials offer several advantages over silicon:
- High electron mobility (especially in graphene) for faster switching.
- Superior thermal conductivity, reducing overheating.
- Mechanical flexibility, enabling foldable and wearable electronics.
- Tunable bandgaps, essential for designing transistors at atomic scales.
These properties make them ideal candidates for angstrom-scale transistors, where silicon simply cannot function reliably.
---
🧭 What Lies Ahead?
If the proposal is approved:
- IISc will establish a national research hub for angstrom-scale electronics.
- The project will create a pipeline of skilled researchers and technologists.
- India could emerge as a design and IP powerhouse in the post-silicon era.
The team has also proposed a self-sustaining roadmap beyond the initial funding phase, aiming to attract private and international collaboration.
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Ai+ Smartphones are listed on Geekbench.
Confirms :
- upto 6GB RAM
- UniSOC T8200 in Nova 5G
- UniSOC T7250 in Pulse 4G
Starting from ₹5000. ( 4G probably
Confirms :
- upto 6GB RAM
- UniSOC T8200 in Nova 5G
- UniSOC T7250 in Pulse 4G
Starting from ₹5000. ( 4G probably
Samsung Galaxy S26 Ultra
▫️6.9"± Straight Screen
▫️Snapdragon 8 Elite 2 for Galaxy 🐉
▫️200MP Main unit (XXL)
▫️50MP (5x) Periscope Telephoto (S) 🔭
▫️12MP (3x) Telephoto (S) 🔭
▫️5000mAh🔋
▫️Faster Charging
▫️7.4mm±
#Samsung #GalaxyS26 #GalaxyS26Ultra #GalaxyUnpacked
▫️6.9"± Straight Screen
▫️Snapdragon 8 Elite 2 for Galaxy 🐉
▫️200MP Main unit (XXL)
▫️50MP (5x) Periscope Telephoto (S) 🔭
▫️12MP (3x) Telephoto (S) 🔭
▫️5000mAh🔋
▫️Faster Charging
▫️7.4mm±
#Samsung #GalaxyS26 #GalaxyS26Ultra #GalaxyUnpacked
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OnePlus Nord 5 Expected Price
- 8+256GB = ₹29,999
- 12+256GB = ₹32,999
- 12+512GB = ₹35,999
- Additional discounts ₹2,000
- 8+256GB = ₹29,999
- 12+256GB = ₹32,999
- 12+512GB = ₹35,999
- Additional discounts ₹2,000
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iPhone 17 Pro: Rumored Features and Upgrades
The iPhone 17 Pro models are rumored to feature several upgrades, including a repositioned Apple logo, faster MagSafe charging, and a new aluminum frame with a unique "part-aluminum, part-glass" design.
Significant camera improvements are expected, such as a 24-megapixel front-facing camera, a 48-megapixel Telephoto rear camera, and the potential for dual video recording and 8K video recording capabilities.
Performance enhancements are anticipated with the A19 Pro chip, manufactured with TSMC's 3nm process, a new Apple-designed Wi-Fi 7 chip, and a substantial increase to 12GB of RAM for improved multitasking and Apple Intelligence performance.
Other rumored features include a Sky Blue color option, a larger battery for the iPhone 17 Pro Max, improved cooling systems, and a redesigned rectangular camera bump.
The iPhone 17 Pro models are rumored to feature several upgrades, including a repositioned Apple logo, faster MagSafe charging, and a new aluminum frame with a unique "part-aluminum, part-glass" design.
Significant camera improvements are expected, such as a 24-megapixel front-facing camera, a 48-megapixel Telephoto rear camera, and the potential for dual video recording and 8K video recording capabilities.
Performance enhancements are anticipated with the A19 Pro chip, manufactured with TSMC's 3nm process, a new Apple-designed Wi-Fi 7 chip, and a substantial increase to 12GB of RAM for improved multitasking and Apple Intelligence performance.
Other rumored features include a Sky Blue color option, a larger battery for the iPhone 17 Pro Max, improved cooling systems, and a redesigned rectangular camera bump.
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